Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

出版年份 2011 全文链接

标题

作者

关键词

出版物

Volume 1, Issue 11, Pages 1846-1855

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2011-10-18

DOI

10.1109/tcpmt.2011.2167154

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