Influence of the thickness of a nanometric copper interlayer on Au/dielectric thermal boundary conductance

标题
Influence of the thickness of a nanometric copper interlayer on Au/dielectric thermal boundary conductance
作者
关键词
-
出版物
JOURNAL OF APPLIED PHYSICS
Volume 124, Issue 10, Pages 105304
出版商
AIP Publishing
发表日期
2018-09-13
DOI
10.1063/1.5030049

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started