Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers

标题
Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers
作者
关键词
-
出版物
Physical Review Applied
Volume 5, Issue 1, Pages -
出版商
American Physical Society (APS)
发表日期
2016-01-27
DOI
10.1103/physrevapplied.5.014009

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