Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists

标题
Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists
作者
关键词
-
出版物
JOURNAL OF APPLIED PHYSICS
Volume 109, Issue 3, Pages 033303
出版商
AIP Publishing
发表日期
2011-02-10
DOI
10.1063/1.3544304

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