Preparation and evaluation of particleboard bonded with a soy flour-based adhesive with a new curing agent

标题
Preparation and evaluation of particleboard bonded with a soy flour-based adhesive with a new curing agent
作者
关键词
-
出版物
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
Volume 27, Issue 18-19, Pages 2053-2064
出版商
Informa UK Limited
发表日期
2012-08-10
DOI
10.1080/01694243.2012.696950

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