3D micro-CT analysis of the interface voids associated with Thermafil root fillings used with AH Plus or a flowable MTA sealer

标题
3D micro-CT analysis of the interface voids associated with Thermafil root fillings used with AH Plus or a flowable MTA sealer
作者
关键词
-
出版物
INTERNATIONAL ENDODONTIC JOURNAL
Volume 46, Issue 3, Pages 253-263
出版商
Wiley
发表日期
2012-10-08
DOI
10.1111/j.1365-2591.2012.02124.x

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