4.5 Article

28 nm 50% Power-Reducing Contacted Mask Read Only Memory Macro With 0.72-ns Read Access Time Using 2T Pair Bitcell and Dynamic Column Source Bias Control Technique

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IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TVLSI.2013.2246201

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28 nm; 2T read only memory (ROM) bitcell; CMOS; embedded ROM; high speed; low-power source bias control; memory

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We propose a new 2T mask read only memory (ROM) with dynamic column source bias control technique, which enables achieving both high-speed operation and low power consumption. It is also possible to overcome the inherent problem of crosstalk between the bitlines. The fabricated 128-kb ROM macro using 28-nm high-k and metal-gate CMOS bulk technology realizes 0.72 ns read access time at the typical 0.85-V supply voltage, which is comparable to that of recent highspeed embedded static random access memories. The measured dynamic power dissipation is reduced by 50% compared to the conventional 2T ROM. The standby leakage can also be reduced to half that of conventional macros.

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