4.6 Article

Electrothermal Simulation and Thermal Performance Study of GaN Vertical and Lateral Power Transistors

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 60, 期 7, 页码 2224-2230

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2013.2261072

关键词

Electrothermal simulation; GaN high-electron-mobility transistor (HEMT); GaN metal-oxide-semiconductor field-effect transistor (MOSFET); power electronics; thermal performance

资金

  1. DOE GIGA program
  2. MIT-Singapore SMART program
  3. MIT GaN Energy Initiative

向作者/读者索取更多资源

In this paper, we present self-consistent electrothermal simulations of single-finger and multifinger GaN vertical metal-oxide-semiconductor field-effect transistors (MOSFETs) and lateral AlGaN/GaN high-electron-mobility transistors (HEMTs) and compare their thermal performance. The models are first validated by comparison with experimental dc characteristics, and then used to study the maximum achievable power density of the device without the peak temperature exceeding a safe operation limit of 150 degrees C (P-150 degrees C). It is found that the vertical MOSFETs have the potential to achieve a higher P-150 degrees C than the lateral HEMTs, especially for higher breakdown voltages and higher scaling level designs.

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