期刊
IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 58, 期 3, 页码 748-757出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2010.2099870
关键词
Chip self-assembly; microfluidic channel; optoelectronic heterogeneous integrated system; Si interposer; through-silicon via (TSV); waveguide; 3-D hybrid integration
资金
- Japan Society for the Promotion of Science [21226009]
- Grants-in-Aid for Scientific Research [21226009] Funding Source: KAKEN
We have developed a new 3-D hybrid integration technology of complementary metal-oxide-semiconductors, microelectromechanical systems (MEMS), and photonics circuits for optoelectronic heterogeneous integrated systems. We have overcome the fabrication difficulties of optoelectromechanical and microfluidics hybrid integration. In order to verify the applied 3-D hybrid integration technology, we fabricated a 3-D optoelectronic multichip module composed of large-scale integration (LSI), MEMS, and photonics devices. The electrical chips of amplitude-shift keying (ASK) LSI, passive, and pressure-sensing MEMS were mounted onto an electrical Si interposer with through-silicon vias (TSVs) and microfluidic channels. Photonics chips of vertical-cavity surface-emitting lasers and photodiodes were embedded into an optical Si interposer with TSVs. The electrical and optical interposers were precisely bonded together to form a 3-D optoelectronic multichip module. The photonics and electrical devices could communicate via TSVs. The photonics devices could be connected via an optical waveguide formed onto the optical interposer. Microfluidic channels were formed into the interposer by a wafer-direct bonding technique for heat sinking from high-power LSIs. In this paper, we evaluated the basic functions of individual chips of LSI, MEMS, and photonics devices as they were integrated into the 3-D optoelectronic multichip module to verify the applied 3-D hybrid integration technology. LSI, passive, MEMS, and photonics devices were successfully implemented. The 3-D hybrid integration technology is capable of providing a powerful solution for realizing optoelectronic heterogeneous integrated systems.
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