4.6 Article

Suppression in Negative Bias Illumination Stress Instability of Zinc Tin Oxide Transistor by Insertion of Thermal TiOx Films

期刊

IEEE ELECTRON DEVICE LETTERS
卷 34, 期 2, 页码 253-255

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2012.2230242

关键词

Photo-bias stability; thermal oxidation; thin-film transistors (TFTs); titanium oxide; zinc tin oxide (ZTO)

资金

  1. Industrial Strategic Technology Development Program
  2. Ministry of Knowledge and Economy/Korea Evaluation Institute of Industrial Technology [10041808]

向作者/读者索取更多资源

This letter examined the insertion effect of thermal TiO2 films on the device performance and photo-bias instability of zinc tin oxide (ZTO) thin-film transistors (TFTs). A 5.0-nm-thick TiOx device inserted at the ZTO/silicon nitride (SiNx) interface exhibited slightly lower mobility (9.4 cm(2)/V . s) compared with that (14.1 cm(2)/V . s) of the reference device with a ZTO/SiNx stack. On the other hand, the negative gate-bias-illumination-stress-induced instability of the TiOx-inserted device was strongly suppressed from 11.0 V (reference device) to 3.0 V. This was attributed to the increase in valence band offset between TiOx and ZTO films, leading to the diminished injection of photoinduced hole carriers into the underlying SiNx bulk region.

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