4.6 Article

InAlN/GaN HEMTs With AlGaN Back Barriers

期刊

IEEE ELECTRON DEVICE LETTERS
卷 32, 期 5, 页码 617-619

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2011.2111352

关键词

AlGaN back barrier; current gain cutoff frequency (f(T)); drain-induced barrier lowering (DIBL); GaN; high-electron-mobility transistor (HEMT); InAlN; output resistance

资金

  1. Defense Advanced Research Projects Agency NEXT program
  2. National Science Foundation
  3. Office of Naval Research
  4. Samsung
  5. Directorate For Engineering
  6. Div Of Electrical, Commun & Cyber Sys [846628] Funding Source: National Science Foundation

向作者/读者索取更多资源

This letter studies the effect of AlGaN back barriers in the dc and RF performance of In0.17Al0.83N/GaN high-electron mobility transistors grown on SiC substrates. When compared to conventional structures without a back barrier, the back barrier effectively prevents the degradation of drain-induced barrier lowering and significantly improves the output resistance in sub-100-nm-gate-length devices. The reduction in short-channel effects helps to increase the frequency performance of AlGaN back-barrier devices. For a 65-nm gate length, the current gain cutoff frequency (f(T)) of a transistor with an AlGaN back barrier is 210 GHz, which is higher than that of the standard device with the same gate length (f(T) = 195 GHz).

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