期刊
IEEE ELECTRON DEVICE LETTERS
卷 30, 期 2, 页码 113-116出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2008.2010415
关键词
GaN; high electron mobility transistor (HEMT); hydrogen silsesquioxane (HSQ) adhesive bonding; layer transfer; N-face GaN; silicon substrate
We present a new method to fabricate N-face GaN/ AlGaN high electron mobility transistors (HEMTs). These devices are extremely promising for ultrahigh frequency applications where low contact resistances and excellent carrier confinement are needed. In this letter, the N-face of a Ga-face AlGaN/GaN epilayer grown on Si(111) is exposed by removing the Si substrate. To provide mechanical support, prior to the substrate removal, the Ga-face of the wafer is bonded to a Si(100) carrier wafer. The resultant N-face GaN/AlGaN heterostructures exhibited record transport properties (mu(e) = 1670 cm(2)/V . s, n(s) = 1.6 x 10(13)/cm(2), and R-sh = 240 Omega/sq). These excellent transport properties rendered N-face HEMTs with 30% higher maximum drain current than Ga-face HEMTs and good RF characteristics (f(T) = 10.7 GHz . mu m and f(max) = 21.5 GHz . mu m), comparable to state-of-the-art Ga-face devices.
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