4.4 Article Proceedings Paper

Residual Stress Analysis of Cold-Sprayed Copper Coatings by Numerical Simulation

期刊

JOURNAL OF THERMAL SPRAY TECHNOLOGY
卷 25, 期 1-2, 页码 131-142

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SPRINGER
DOI: 10.1007/s11666-015-0308-1

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cold spraying; copper coating; numerical simulation; residual stress

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In this paper, an analysis on the residual stress evolution of cold-sprayed copper coatings on Cu and Al substrates was performed. To investigate the influences of particle velocity, temperature and material combination on the final residual stresses, an integrated frame of calculation was proposed based on the simulation results obtained from the developed thermo-mechanically coupled Eulerian model. In a single Cu splat, generally speaking, the maximum residual stress and plastic deformation are concentrated at the outside contact zone rather than at the center point of initial impact. The action of friction shear between the particle and substrate during impacting should be considered as one of the essential factors on the final residual stress. And the states of residual stresses can vary significantly depending on the material combination, particle velocity, and temperature. In a single pass Cu coating, the residual stress fluctuates across the coating and there exists both compressive stress and tensile stress within the coating. At a certain range of impacting velocities, the resultant residual stresses increase with the increase of particle velocity. The present simulated results are related to the reported experiments by others, showing that the residual stress states and stress change trend are different from some of the reported results.

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