Defect spatial pattern recognition using a hybrid SOM–SVM approach in semiconductor manufacturing

标题
Defect spatial pattern recognition using a hybrid SOM–SVM approach in semiconductor manufacturing
作者
关键词
-
出版物
EXPERT SYSTEMS WITH APPLICATIONS
Volume 36, Issue 1, Pages 374-385
出版商
Elsevier BV
发表日期
2007-10-12
DOI
10.1016/j.eswa.2007.09.023

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