Electrodeposition of Superhydrophobic Cu Film on Active Substrate from Deep Eutectic Solvent

标题
Electrodeposition of Superhydrophobic Cu Film on Active Substrate from Deep Eutectic Solvent
作者
关键词
-
出版物
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 162, Issue 8, Pages D313-D319
出版商
The Electrochemical Society
发表日期
2015-05-03
DOI
10.1149/2.0171508jes

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