Microstructure and properties of polyamideimide/silica hybrids compatibilized with 3-aminopropyltriethoxysilane

In this work, we prepared and characterized polyamideimide (PAI)/silica hybrids compatibilized with 3-aminopropyltriethoxysilane (APTES). PAI/silica nanohybrid thin films were prepared using an in situ sot-gel process, followed by thermal imidization. We have investigated the microstructures and properties of the PAI/silica hybrids using FT-IR spectroscopy, X-ray diffraction, small-angle X-ray scattering (SAXS), and differential scanning calorimetry (DSC). We also measured their tensile properties, thermal properties, refractive indices, and dielectric constants. In general, the properties of the PAI/silica hybrids were optimized when the silica content was 6 wt.%. (c) 2008 Elsevier Ltd. All rights reserved.