Influence of Bias-Induced Copper Diffusion on the Resistive Switching Characteristics of a SiON Thin Film

标题
Influence of Bias-Induced Copper Diffusion on the Resistive Switching Characteristics of a SiON Thin Film
作者
关键词
-
出版物
ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume 14, Issue 2, Pages H93
出版商
The Electrochemical Society
发表日期
2010-12-04
DOI
10.1149/1.3518701

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