Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

标题
Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness
作者
关键词
-
出版物
COMPUTATIONAL MATERIALS SCIENCE
Volume 92, Issue -, Pages 13-21
出版商
Elsevier BV
发表日期
2014-06-07
DOI
10.1016/j.commatsci.2014.05.019

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More