Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications
出版年份 2015 全文链接
标题
Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications
作者
关键词
Percolation Threshold, Conductive Filler, Silver Flake, Electrical Pathway, Electrical Conductive Adhesive
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 26, Issue 7, Pages 4730-4745
出版商
Springer Nature
发表日期
2015-04-06
DOI
10.1007/s10854-015-3016-1
参考文献
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