THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING

标题
THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING
作者
关键词
-
出版物
CHEMICAL ENGINEERING COMMUNICATIONS
Volume 195, Issue 8, Pages 847-888
出版商
Informa UK Limited
发表日期
2008-04-26
DOI
10.1080/00986440801930302

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