Comparisons between Heat Pipe, Thermoelectric System, and Vapour Compression Refrigeration System for Electronics Cooling

标题
Comparisons between Heat Pipe, Thermoelectric System, and Vapour Compression Refrigeration System for Electronics Cooling
作者
关键词
-
出版物
APPLIED THERMAL ENGINEERING
Volume -, Issue -, Pages -
出版商
Elsevier BV
发表日期
2018-09-29
DOI
10.1016/j.applthermaleng.2018.09.120

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