期刊
APPLIED SURFACE SCIENCE
卷 257, 期 22, 页码 9264-9268出版社
ELSEVIER
DOI: 10.1016/j.apsusc.2011.05.006
关键词
Hot lift-off; Polymer bonding lithography
类别
资金
- National Natural Science Foundation of China [20923003, 21004064]
- National Basic Research Program of China (973 Program) [2009CB930603]
Micropatterning and transferring of polymeric semiconductor thin films by hot lift-off and polymer bonding lithography in fabrication of OFETs with polymeric dielectric on the flexible substrate was proposed. The desired polymeric semiconductor patterns were fabricated on the flat polydimethylsiloxane (PDMS) surface with a selective lift-off method we proposed previously. The isolated and well defined polymeric semiconductor patterns left on the flat PDMS surface can be further transferred to the gate polymeric dielectric surface by polymer bonding lithography due to the low interfacial energy of PDMS. The transistor fabricated with this 'dry' process has a higher field-effect mobility compared with that using spin coated semiconductor layer. (C) 2011 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据