Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition

标题
Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
作者
关键词
-
出版物
APPLIED SURFACE SCIENCE
Volume 254, Issue 18, Pages 5891-5894
出版商
Elsevier BV
发表日期
2008-04-09
DOI
10.1016/j.apsusc.2008.03.153

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