Enhancing the thermoelectric figure of merit through the reduction of bipolar thermal conductivity with heterostructure barriers
出版年份 2014 全文链接
标题
Enhancing the thermoelectric figure of merit through the reduction of bipolar thermal conductivity with heterostructure barriers
作者
关键词
-
出版物
APPLIED PHYSICS LETTERS
Volume 105, Issue 5, Pages 052106
出版商
AIP Publishing
发表日期
2014-08-07
DOI
10.1063/1.4892653
参考文献
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