Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

标题
Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
作者
关键词
-
出版物
APPLIED PHYSICS LETTERS
Volume 104, Issue 6, Pages 061102
出版商
AIP Publishing
发表日期
2014-02-11
DOI
10.1063/1.4864406

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