Decoding the mechanism of the mechanical transfer of a GaN-based heterostructure via an h-BN release layer in a device configuration

标题
Decoding the mechanism of the mechanical transfer of a GaN-based heterostructure via an h-BN release layer in a device configuration
作者
关键词
-
出版物
APPLIED PHYSICS LETTERS
Volume 105, Issue 12, Pages 121605
出版商
AIP Publishing
发表日期
2014-09-24
DOI
10.1063/1.4896506

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