Silicon carbide wafer bonding by modified surface activated bonding method

标题
Silicon carbide wafer bonding by modified surface activated bonding method
作者
关键词
-
出版物
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 54, Issue 3, Pages 030214
出版商
Japan Society of Applied Physics
发表日期
2015-01-15
DOI
10.7567/jjap.54.030214

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