4.6 Article

Pick, break, and placement of one-dimensional nanostructures for direct assembly and integration

期刊

APPLIED PHYSICS LETTERS
卷 96, 期 15, 页码 -

出版社

AMER INST PHYSICS
DOI: 10.1063/1.3374879

关键词

adhesion; II-VI semiconductors; nanoelectronics; nanotechnology; nanowires; semiconductor quantum wires; surface morphology; titanium compounds; zinc compounds

向作者/读者索取更多资源

A direct, simple, and versatile assembly method for the manipulation of one-dimensional nanostructures and their integration with microscale devices has been demonstrated. Using a probe station with an unbiased tungsten probe, the facile process has been employed to accurately pick, break, and place individual titanium dioxide nanoswords and zinc oxide nanowires under a room-temperature, dry environment. The surface morphology of the nanostructures, probe tips, and adhesion forces were characterized. As such, the technique could enable the rapid assembly of individual nanostructures with complementary metal-oxide-semiconductor-compatible or complex microscale devices.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.6
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据