Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air

标题
Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air
作者
关键词
-
出版物
Applied Physics Express
Volume 1, Issue -, Pages 112201
出版商
IOP Publishing
发表日期
2008-11-15
DOI
10.1143/apex.1.112201

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