Molecular dynamics investigations on polishing of a silicon wafer with a diamond abrasive

标题
Molecular dynamics investigations on polishing of a silicon wafer with a diamond abrasive
作者
关键词
-
出版物
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 100, Issue 1, Pages 89-104
出版商
Springer Nature
发表日期
2010-02-10
DOI
10.1007/s00339-010-5570-y

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