Thermal management of electronic devices using carbon foam and PCM/nano-composite

出版年份 2015 全文链接

标题

作者

关键词

Electronics cooling, Thermal management, PCM, Nano-composite, Carbon foam

出版物

Volume 89, Issue -, Pages 79-86

出版商

Elsevier BV

发表日期

2014-11-22

DOI

10.1016/j.ijthermalsci.2014.10.012

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