A research on ultrasonic-assisted abrasive waterjet polishing of hard-brittle materials

Wear of diamond grinding wheel in ultrasonic vibration-assisted grinding of silicon carbide

(2014) Kai Ding et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Investigation on the bonding strength patterns of ultrasonic vibration tools and influence on working performance during rotary ultrasonic grinding

(2012) Yunfeng Liu et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Analytical modeling and experimental investigation of ultrasonic-vibration assisted oblique turning, part I: Kinematics analysis

(2012) M.J. Nategh et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Ultraprecision finishing of micro-aspheric surface by ultrasonic two-axis vibration assisted polishing

(2010) H. Suzuki et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

An experimental study of ultrasonic vibration-assisted grinding of polysilicon using two-dimensional vertical workpiece vibration

(2010) Y. Peng et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Effect of process parameter on the kerf geometry in abrasive water jet milling

(2010) A. Alberdi et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Mechanism of Surface Finishing in Ultrasonic-Assisted Magnetic Abrasive Finishing Process

(2010) Rahul S. Mulik et al.   MATERIALS AND MANUFACTURING PROCESSES

Experimental study on abrasive waterjet polishing for hard–brittle materials

(2009) H.T. Zhu et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Ultraprecision surface finishing of nano-ZrO2 ceramics using two-dimensional ultrasonic assisted grinding

(2008) Yan Yanyan et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Influence of ultrasonic vibrations on dry grinding of soft steel

(2008) Taghi Tawakoli et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

A new model for predicting the depth of cut in abrasive waterjet contouring of alumina ceramics

(2008) J. Wang   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique

(2007) N. Kobayashi et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY