Deposition behavior of thermally softened copper particles in cold spraying

标题
Deposition behavior of thermally softened copper particles in cold spraying
作者
关键词
-
出版物
ACTA MATERIALIA
Volume 61, Issue 14, Pages 5105-5118
出版商
Elsevier BV
发表日期
2013-06-20
DOI
10.1016/j.actamat.2013.04.041

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