4.7 Article

Polycrystal model of the mechanical behavior of a Mo-TiC30 vol.% metal-ceramic composite using a three-dimensional microstructure map obtained by dual beam focused ion beam scanning electron microscopy

期刊

ACTA MATERIALIA
卷 60, 期 4, 页码 1623-1632

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2011.11.055

关键词

Metal-ceramic composite; Numerical simulation; Crystal plasticity; Polycrystal modeling; Damage

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The mechanical behavior of a Mo-TiC30 (vol.%) ceramic metal composite was investigated over a wide temperature range (25-700 degrees C). High-energy X-ray tomography was used to reveal percolation of the hard titanium carbide phase through the composite. Using a polycrystal approach for a two-phase material, finite-element simulations were performed on a real three-dimensional (3-D) aggregate of the material. The 3-D microstructure, used as the starting configuration for the predictions, was obtained by serial sectioning in a dual beam focused ion beam scanning electron microscope coupled to an electron backscattered diffraction system. The 3-D aggregate consists of a molybdenum matrix and a percolating TiC skeleton. As for most body-centered cubic (bcc) metals, the molybdenum matrix phase is characterized by a change in plasticity mechanism with temperature. We used a polycrystal model for bcc materials which was extended to two phases (TiC and Mo). The model parameters of the matrix were determined from experiments on pure molydenum. For all temperatures investigated the TiC particles were considered to be brittle. Gradual damage to the TiC particles was treated, based on an accumulative failure law that is approximated by evolution of the apparent particle elastic stiffness. The model enabled us to determine the evolution of the local mechanical fields with deformation and temperature. We showed that a 3-D aggregate representing the actual microstructure of the composite is required to understand the local and global mechanical properties of the composite studied. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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