4.7 Article

In situ synchrotron tomographic investigation of the solidification of an AlMg4.7Si8 alloy

期刊

ACTA MATERIALIA
卷 60, 期 6-7, 页码 2568-2577

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2012.01.024

关键词

In situ; Eutectic solidification; Synchrotron radiation computed tomography; 3-D characterization; Cast Al-Mg-Si alloys

资金

  1. European Synchrotron Radiation Facility [MA560]
  2. Worshipful Company of Armourers and Braziers
  3. Austrian Science Fund [L588-N14, P22876-N22]
  4. Hungarian Research Fund [OTKA-K-67692]
  5. Austrian Science Fund (FWF) [P22876] Funding Source: Austrian Science Fund (FWF)

向作者/读者索取更多资源

The solidification sequence of an AlMg4.7Si8 alloy is imaged in situ by synchrotron microtomography. Tomograms with (1.4 mu m)(3)/voxel have been recorded every minute while cooling the melt from 600 degrees C at a cooling rate of 5 K min(-1) to 540 degrees C in the solid state. The solidification process starts with the three-dimensional evolution of the alpha-Al dendritic structure at 590 degrees C. The growth of the a-Al dendrites is described by curvature parameters that represent the coarsening quantitatively, and ends in droplet-like shapes of the secondary dendrite arms at 577 degrees C. There, the eutectic valley of alpha-Al/Mg2Si is reached, forming initially octahedral Mg2Si particles preferentially at the bases of the secondary dendrite arms. The eutectic grows with seaweed-like Mg2Si structures, with increasing connectivity. During this solidification stage Fe-aluminides form and expand as thin objects within the interdendritic liquid. Finally, the remaining liquid freezes as ternary alpha-Al/Mg2Si/Si eutectic at 558 degrees C, increasing further the connectivity of the intermetallic phases. The frozen alloy consists of four phases exhibiting morphologies characteristic of their mode of solidification: alpha-Al dendrites, eutectic alpha-Al/Mg2Si Chinese script with Fe-aluminides, and interpenetrating alpha-Al/Mg2Si/Si ternary eutectic. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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