4.7 Article

The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges

期刊

ACTA MATERIALIA
卷 59, 期 1, 页码 19-29

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2010.07.045

关键词

Stacking fault tetrahedron; Growth; Ledge mechanism; Molecular dynamics simulations; Shockley dipole

资金

  1. Ministry of Science and Technology of China [2006CB605104]
  2. Natural Science Foundation of China [50911130367, 50631030]
  3. Institute of Metal Research, Chinese Academy of Sciences

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Ledge expansion and the concomitant growth of a stacking fault tetrahedron (SFT) are investigated in Al and Cu by molecular dynamics (MD) simulations by addition of vacancy rods with selected lengths Ledge expansion is largely governed by the site preference of vacancies on the SFT edges resulting in distinct stable ledged SFTs Both edge- and corner-facing ledge configurations may be adopted The growth of SFTs, especially large ones, is controlled by thermal agitation The mobile part of the ledges consists of a dipole of Shockley partials generally oriented in the 60 degrees mixed orientation that move in a thermally activated manner, reflecting a certain core reorganization of the Shockley dipole (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved

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