Alucone Interlayers to Minimize Stress Caused by Thermal Expansion Mismatch between Al2O3 Films and Teflon Substrates

标题
Alucone Interlayers to Minimize Stress Caused by Thermal Expansion Mismatch between Al2O3 Films and Teflon Substrates
作者
关键词
-
出版物
ACS Applied Materials & Interfaces
Volume 5, Issue 3, Pages 1165-1173
出版商
American Chemical Society (ACS)
发表日期
2012-12-29
DOI
10.1021/am303077x

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