Direct Deposition of Highly Conductive Aluminum Thin Film on Substrate by Solution-Dipping Process

标题
Direct Deposition of Highly Conductive Aluminum Thin Film on Substrate by Solution-Dipping Process
作者
关键词
-
出版物
ACS Applied Materials & Interfaces
Volume 5, Issue 11, Pages 4581-4585
出版商
American Chemical Society (ACS)
发表日期
2013-05-28
DOI
10.1021/am400812e

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