Morphology, Bandgap, and Grain Size Tailoring in Cu2O Thin Film by SILAR Method

出版年份 2015 全文链接

标题

Morphology, Bandgap, and Grain Size Tailoring in Cu2O Thin Film by SILAR Method

作者

关键词

-

出版物

IEEE TRANSACTIONS ON NANOTECHNOLOGY

Volume 14, Issue 1, Pages 108-112

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2014-11-12

DOI

10.1109/tnano.2014.2369438

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Protocol

Reagent

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