Article
Engineering, Electrical & Electronic
Yuchen Xiao, Huiyi Tang, Hehe Zhang, Xiaoling Yang, Ling Sun, Yong Xie, Baoan Wu, Baifeng Luan, Weidong Xie, Xinnan Cai
Summary: This study develops high-performance Au-coated Ag alloy wires (ACAA wires) and demonstrates the effect of Au coating layers on the bonding performance and oxidation resistance for stable and reliable electronic packaging applications. The results show that the bonding strength and oxidation resistance of ACAA wires are enhanced by the Au coating layer.
MICROELECTRONICS INTERNATIONAL
(2023)
Article
Materials Science, Multidisciplinary
Chuantong Chen, Dongjin Kim, Yang Liu, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu, Katsuaki Suganuma
Summary: This study proposes the use of combined micron-sized Cu particles with Ag-amino composite for robust Cu-Cu bonding under low pressure and temperature in ambient atmosphere. The joints exhibit excellent mechanical stability during high temperature storage and remarkable potential in SiC power devices packaging. The thermal resistance of the joint structure is almost unaffected and no large delamination is observed after power cycle test.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Chemistry, Multidisciplinary
Yoonho Kim, Seungmin Park, Sarah Eunkyung Kim
Summary: The study showed that using a 15-nm Ag nanofilm for Cu bonding at 150 degrees Celsius provides good bonding quality, prevents oxidation, and allows rapid Cu-Cu bonding to occur.
APPLIED SCIENCES-BASEL
(2021)
Article
Engineering, Electrical & Electronic
Zhongyang Deng, Guisheng Zou, Hongqiang Zhang, Qiang Jia, Wengan Wang, Ying Wu, A. Zhanwen, Bin Feng, Lei Liu
Summary: Achieving high strength and reliable bonding below 150 degrees C using Ag nanoparticle pastes is still a challenge. This work developed an organic-free nano-Ag multilayer film consisting of a compact layer and a loose layer using pulsed laser deposition (PLD). The shear strength of sintered joints was strongly dependent on the diffusion behavior and microstructure evolution of loose layers. The sub-10-nanometer grains and high quantity of lattice disorders in the Ag nanoparticles induced a high diffusion driving force, ensuring high-strength bonding inside the bondline. In addition, pre-bonding and nano-bump effects of the deposited compact layer enhanced the interfacial bonding between bondline and metalized surfaces. This work provides a promising method for robust die attachment below 150 degrees C.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Chemistry, Physical
Qiang Jia, Guisheng Zou, Hongqiang Zhang, Wengan Wang, Hui Ren, Zhanwen A, Zhongyang Deng, Shaohua Yan, Daozhi Shen, Lei Liu
Summary: This study successfully prepared a new material with high shear strength and excellent resistance to silver ionic migration by utilizing Ag-Pd nanoalloy as the die attach material. The research revealed the sintering mechanism of the alloy and confirmed the high reliability of Ag-Pd nanoalloy for low temperature bonding.
APPLIED SURFACE SCIENCE
(2021)
Article
Materials Science, Multidisciplinary
L. Prince, M-A. Rousseau, X. Noirfalise, L. Dangreau, L. B. Coelho, M. -G. Olivier
Summary: This study investigated the effect of carbonate ions on the corrosion protection of AZ31 magnesium alloy, highlighting the inhibitive effect of CO32- ions and discussing the underlying mechanisms. Multiple techniques including EIS, potentiodynamic polarization measurements, hydrogen evolution tests, SEM-EDX analysis, and XPS were used to analyze the corrosion behavior.
Article
Materials Science, Multidisciplinary
Zheng Shao, Masashi Nishimoto, Izumi Muto, Yu Sugawara
Summary: In situ observations were conducted on the filiform corrosion process of die-cast AZ91D magnesium alloy in 0.1 and 0.01 M NaCl solutions (pH 8.0) using a microscale polarization technique. The morphology changes were monitored in real-time through an optical microscope, revealing that filiform corrosion mainly occurred in lamellar alpha + beta structures adjacent to beta phases, with the beta phases remaining intact after corrosion.
Article
Materials Science, Multidisciplinary
Qiang Jia, Zhongyang Deng, Lei Liu, Hongqiang Zhang, Wengan Wang, Limin Ma, Fu Guo, Guisheng Zou
Summary: In this study, a sandwich structure nanoparticle film composed of an Ag transition layer, nanoalloy layer, and Ag transition layer was developed to enhance the interface strength in low-temperature bonding. The optimized sandwich structure significantly increased the shear strength of Ag-based nanoalloy sintered joints. The low-temperature spreadability of the Ag transition layer provided a micro-nano structure and driving force for nanoalloy sintering on the substrate, resulting in easier spreading and higher effective bonding area for the nanoalloy particles. This interface-enhancing strategy enables the Ag-based nanoalloy to be a high-reliability die-attach material with low-temperature bondability.
Article
Materials Science, Multidisciplinary
Debdipta Banik, B. Bhushan, S. Mukherjee, J. Bhagyaraj, Hiroshi Fujiwara, Kei Ameyama, K. Mondal
Summary: This study investigates the influence of harmonic structure on the corrosion behavior of high entropy Cantor alloy in a freely aerated 3.5 wt% NaCl solution. It is found that the Cantor alloy with a harmonic structure, featuring a continuous shell region and discreet core regions, exhibits the highest corrosion resistance among the tested materials. The excellent corrosion-resistive properties are attributed to the early passivation by enrichment of Cr in the oxide layer in the shell region and reversal of polarity during corrosion.
MATERIALS CHEMISTRY AND PHYSICS
(2023)
Article
Metallurgy & Metallurgical Engineering
Mo-yang Yin, Zhou Li, Zhu Xiao, Yong Pang, Ya-ping Li, Zi-yan Shen
Summary: The corrosion behavior of a copper-based shape memory alloy in 3.5 wt.% NaCl solution was investigated using potentiodynamic polarization measurements, electrochemical impedance spectroscopy (EIS), and X-ray photoelectron spectroscopy (XPS). The corrosion product layer on the alloy surface became thick and porous after 4 days of immersion, leading to an increase in corrosion rate and a transition from polarization control to diffusion control in the corrosion mechanism. The corrosion products contained mainly CuO, ZnO, Al2O3, MnO/Mn2O3, MnO2, and Al(OH)3, with transitions from Cu2O to CuO and Al2O3 to Al(OH)3 occurring during corrosion.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
(2021)
Article
Engineering, Electrical & Electronic
Jiuyang Tang, Liangtao Li, Guoqi Zhang, Jing Zhang, Pan Liu
Summary: In this study, an ultrasonic bonding model was established using the Finite Element Method to simulate the joint quality of thick aluminum wires. The model was verified through experimental validation and analyzed to find the optimal process parameters. A regression equation was established based on stress distributions and wire deformation, providing an optimized process for ultrasonic wedge bonding of thick aluminum wires.
MICROELECTRONICS RELIABILITY
(2022)
Article
Engineering, Electrical & Electronic
Yan-Cheng Lin, Pei-Ing Lee, Po-Ching Wu, Chun-Hao Chen, Tung-Han Chuang
Summary: Coarse-grained Ag-4Pd alloy wires exhibited longer dendrite contact times and short circuit times in water drop tests, while fine-grained wires showed faster ion migration. The passive film on fine-grained wires was more easily broken down, with a higher dissolution tendency.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Engineering, Manufacturing
Yoonho Kim, Sarah Eunkyung Kim
Summary: In this study, Cu bonding using an Ag nanolayer was examined to prevent copper surface oxidation and achieve low-temperature bonding. The annealing process was found to result in complete diffusion of Cu into the bonding interface and create a uniform and pure Cu-to-Cu bond. However, the Ag nanolayer did not fully dissolve into the Cu thin film, forming a thin Ag band. The average shear strength of the annealed specimens was relatively low at 6.5 MPa.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2023)
Article
Chemistry, Physical
Sarabjot Singh, Kathleen Dunn
Summary: The properties of Cu(Ag) alloy films were studied for their potential use in hybrid bonding interconnections. The silver content in the films decreased with increasing duty cycle, while silver was uniformly distributed throughout the film. The resistance, coefficient of thermal expansion, modulus, and hardness of the films showed linear dependence on the silver content. Addition of 1.25% silver resulted in significant increases in the CTE, Young's modulus, and film hardness.
Review
Chemistry, Multidisciplinary
Jianfeng Yan
Summary: This study mainly reviews the application of polyol-based silver nanoparticles in electronic packaging, showing that the paste containing a high concentration of Ag NPs has good bondability and high-temperature properties. By reducing organic components, the polyol-based Ag NP paste can enhance bondability and suppress the coffee ring effect, with better mechanical properties of joints than lead-based solders after high-temperature storage. The sintering-bonding technology using polyol-based Ag NPs is helpful for low-temperature interconnection in electronic packaging applications.
Article
Engineering, Electrical & Electronic
Yan-Cheng Lin, Chun-Hao Chen, Yu-Zhen He, Sheng-Chi Chen, Tung-Han Chuang
JOURNAL OF ELECTRONIC MATERIALS
(2018)
Article
Materials Science, Multidisciplinary
Tung-Han Chuang, Chun-Hao Chen
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
(2018)
Article
Engineering, Electrical & Electronic
Tung-Han Chuang, Shih-Wen Hsu, Yan-Cheng Lin, Wei-Ting Yeh, Chun-Hao Chen, Pei-Ing Lee, Po-Ching Wu, Hao-Peng Cheng
JOURNAL OF ELECTRONIC MATERIALS
(2020)
Article
Engineering, Manufacturing
Chun-Hao Chen, Yan-Cheng Lin, Anne Groth, Yu-Chang Lai, Chia-Ying Lin, Heng-Ming Chang, Tung-Han Chuang
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2020)
Article
Engineering, Electrical & Electronic
Chun-Hao Chen, Shih-Wen Hsu, Tung-Han Chuang
Summary: The study found that the wettability of intermetallic compounds (IMCs) of stud bump materials Ag and Ag-4Pd with Sn-3Ag-0.5Cu (SAC305) solder is better than that of Au and Cu. The growth kinetics of IMCs in Ag and Ag-4Pd stud bumps with SAC305 solder follow the Arrhenius equation. The formation mechanisms of IMCs in Ag and Ag-4Pd stud bumps were found to be diffusion controlled.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Engineering, Manufacturing
Tung-Han Chuang, Shih-Wen Hsu, Chun-Hao Chen
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2020)
Article
Chemistry, Physical
Chun-Hao Chen, Yu-Chang Lai, Tung-Han Chuang
Summary: The microstructural evolution of Ag-4Pd ribbon under various annealing conditions was investigated in this study using the EBSD technique. The results showed abnormal grain growth after prolonged annealing treatment, with calculated grain growth time exponent (n) and activation energy providing insights into the dominance of grain boundary diffusion in the material. The deviation of n value and activation energy from those of pure silver could be attributed to alloying elements and twin boundaries within the microstructure.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Engineering, Electrical & Electronic
Yan-Cheng Lin, Pei-Ing Lee, Po-Ching Wu, Chun-Hao Chen, Tung-Han Chuang
Summary: Coarse-grained Ag-4Pd alloy wires exhibited longer dendrite contact times and short circuit times in water drop tests, while fine-grained wires showed faster ion migration. The passive film on fine-grained wires was more easily broken down, with a higher dissolution tendency.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Chemistry, Physical
Chun-Hao Chen, Wei-Ting Yeh, Tung-Han Chuang
Summary: This study introduces a method of joining titanium with zinc antimonide by diffusion bonding, preventing critical mutual-interdiffusion phenomenon, and suggests optimal process parameters for manufacturing TE modules. It is proved that titanium can serve as suitable barrier layer and electrode material for Zn4Sb3 TE modules.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Chemistry, Multidisciplinary
Chun-Hao Chen, Yu-Kai Sun, Yu-Chang Lai, Shih-Ying Chang, Tung-Han Chuang
Summary: The study investigates the joining of aluminum alloy 6061 using solid-state diffusion bonding and post-weld heat treatment. Experimental results show that post-weld heat treatment, especially the T6-PWHT, significantly enhances the joint strength, making it suitable for industrial applications.
APPLIED SCIENCES-BASEL
(2021)
Article
Chemistry, Physical
Chun-Hao Chen, Pei-Ing Lee, Tung-Han Chuang
Summary: This study investigates the microstructure evolution of Ag-alloy bonding wire during electromigration (EM) using electron backscatter diffraction (EBSD), providing a new perspective to settle the controversy over the diffusion mechanism. The study focuses on grain growth, the influence of coincidence site lattice (CSL) on the grain boundary network, texture transition, and the impact of thermal energy during EM. A stage-like transition in the dominant diffusion mechanism is proposed and substantiated based on microstructure evolution.
JOURNAL OF ALLOYS AND COMPOUNDS
(2022)
Article
Engineering, Electrical & Electronic
Chun-Hao Chen, Tung-Han Chuang
Summary: This study evaluated the bondability of ultrasonic ribbon bonding on DBC substrates by adjusting the bonding parameters. The results showed that excessive ultrasonic energy could cause heel damage. Increasing the bonding power promoted the formation of the bonding surface.
MICROELECTRONICS RELIABILITY
(2022)
Article
Materials Science, Multidisciplinary
Chun-Hao Chen, Yan-Cheng Lin, Po-Ching Wu, Tung-Han Chuang
Summary: The growth of Ag dendrites induced by Ag ion migration in Ag-4Pd alloy wire couples immersed in pure water was studied. The time of dendrite contact and short circuit decreased with increasing voltage and wire pitch. The formation time of hydrogen bubbles and Ag spikes decreased slightly with increasing voltage, leading to a higher growth rate of Ag dendrites. A reaction mechanism for the electrolytic migration of Ag-4Pd wire couple is proposed.
Article
Chemistry, Physical
Chun-Hao Chen, Chung-Lin Yang, Tung -Han Chuang
Summary: The miniaturization and power escalation of electronic components have led to increased research interest in thermal interface materials (TIMs) for heat dissipation. In this study, the Cu/In32.5Bi16.5Sn/Cu structure was used to simulate the practical application of TIM in joining the substrate and heat sink. The growth kinetics of the intermetallic compound (IMC) at the In32.5Bi16.5Sn/Cu interface were investigated, and the aging test showed an increase in thermal impedance and thickening of the IMC, indicating degradation of thermal performance.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)