期刊
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
卷 22, 期 5, 页码 3053-3058出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDEI.2015.004925
关键词
Polyamide-imide; PAI; High glass transition; Dielectric properties; Electrical conduction
The dielectric properties of a novel high-glass transition polyamide-imide (hT(g)-PAI, T-g=333 degrees C) are investigated for its high temperature use as an insulating material in the range above 250 degrees C in order to extend the limit of conventional PAI (c-PAI, T-g=277 degrees C). Four dielectric processes are identified between 50 degrees C and 400 degrees C. Among them, the electrical conduction (sigma-conduction) is clearly reduced particularly in the range from 250 degrees C to 320 degrees C, i.e. T-g(c-PAI)<= T <= T-g(hT(g)-PAI). The main reason explaining such an enhancement is the shift of ionic conduction contribution towards higher temperatures in hT(g)-PAI compared to c-PAI. In hT(g)-PAI, the higher-T-g value allows better controlling the free volume expansion responsible of large ions motions in the bulk. In the range of potential applications (i.e. 250 to 320 degrees C), the sigma-conduction of hT(g)-PAI has an activation energy of 2.3 eV (similar to 221.9 kJ mol(-1)).
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据