UV nanosecond laser machining and characterization for SiC MEMS sensor application

出版年份 2018 全文链接

标题

作者

关键词

MEMS piezoresistive accelerometer, 4H-SiC, UV laser machining, Groove, Through-hole

出版物

Volume 276, Issue -, Pages 196-204

出版商

Elsevier BV

发表日期

2018-04-23

DOI

10.1016/j.sna.2018.04.029

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