A 0.13 μm CMOS System-on-Chip for a 512 × 424 Time-of-Flight Image Sensor With Multi-Frequency Photo-Demodulation up to 130 MHz and 2 GS/s ADC

标题
A 0.13 μm CMOS System-on-Chip for a 512 × 424 Time-of-Flight Image Sensor With Multi-Frequency Photo-Demodulation up to 130 MHz and 2 GS/s ADC
作者
关键词
-
出版物
IEEE JOURNAL OF SOLID-STATE CIRCUITS
Volume 50, Issue 1, Pages 303-319
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-11-22
DOI
10.1109/jssc.2014.2364270

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