Via Method for Lithography Free Contact and Preservation of 2D Materials

标题
Via Method for Lithography Free Contact and Preservation of 2D Materials
作者
关键词
-
出版物
NANO LETTERS
Volume 18, Issue 2, Pages 1416-1420
出版商
American Chemical Society (ACS)
发表日期
2018-02-01
DOI
10.1021/acs.nanolett.7b05161

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