期刊
MICROELECTRONIC ENGINEERING
卷 197, 期 -, 页码 76-82出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2018.05.008
关键词
MEMS packaging; Annealing for degassing; Surface activated bonding; Au thin film bonding; Pt diffusion barrier layer; Low-temperature bonding
资金
- New Energy and Industrial Technology Development Organization (NEDO)
For micro electro mechanical system (MEMS) packaging that can control the internal atmosphere for a long period, we demonstrated a low-temperature bonding process for Au films after vacuum annealing for degassing. Ti (5 nm)/Au (12 nm) and Ti (5 nm)/Pt (10 nm)/Au (12 nm) (from bottom to top) films on Si substrates were bonded by a sequence consisting of surface activation by Ar plasma, vacuum annealing at 200 degrees C, and bonding at 200 degrees C or 40 degrees C. The Ti/Au films failed to form bonding at low temperatures in the case of bonding after the vacuum annealing. However, the Ti/Pt/Au films were successfully bonded even after the vacuum annealing. After the vacuum annealing step, TiO2 formed on the Ti/Au film surface due to thermal diffusion of Ti atoms through the thin Au film. Neither Pt nor Ti atoms were detected on the Ti/Pt/Au film surface after the vacuum annealing step. It is assumed that the thin Pt layer blocked the thermal diffusion of Ti atoms.
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