A Thermodynamic Study of Adsorption of Benzyl Viologen and Polyethylene Glycol and Their Displacement by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition

Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating

(2016) Lindsay Boehme et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution

(2016) Zhihua Tao et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

(2015) Shaojun Ren et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

On the Displacement of Adsorbed Polyethylene Glycol by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition

(2014) Ashleigh Kreider et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode

(2013) Xubin Lu et al.   JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

(2012) Nguyen T.M. Hai et al.   ELECTROCHIMICA ACTA

Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives

(2012) Nguyen T. M. Hai et al.   Journal of Physical Chemistry C

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

(2011) P. Broekmann et al.   ELECTROCHIMICA ACTA

Mechanistic Analysis of the “Bottom-Up” Fill in Copper Interconnect Metallization

(2009) Rohan Akolkar et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY