Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process

出版年份 2018 全文链接

标题

作者

关键词

出版物

Volume -, Issue -, Pages 1-12

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2018-06-22

DOI

10.1109/jmems.2018.2843722

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