Optimization of upcycling of Ti-6Al-4V swarf

Application of Ti alloys in the aerospace and biomedical industries is on the incline which typically results in more than 80% of Ti alloy in swarf. Hence, developing innovative processes to recycle Ti alloys swarf is becoming an increasingly valuable issue. Equal-channel angular pressing (ECAP) compaction with a series of post deformation heat treatments were designed and investigated in this study as method to upcycle Ti swarf. After a single ECAP compaction process, the compacts possessed near 99% theoretical density and annealing treatment further increased the density and enhanced the bonding between chips. The microstructural and textural evolution of alpha and beta phases after ECAP and annealing was examined. Upcycling of fine-grained Ti-6Al-4V compacts with minimum crystallographic texture intensity were produced from swarf using economically-viable way.