Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures

出版年份 2018 全文链接

标题

作者

关键词

Selective laser melting, Additive manufacturing, HDPE, Copper, Resistivity, 3D electronics

出版物

Volume 254, Issue -, Pages 310-324

出版商

Elsevier BV

发表日期

2017-11-15

DOI

10.1016/j.jmatprotec.2017.11.020

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