Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding

标题
Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding
作者
关键词
-
出版物
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
Volume 32, Issue 14, Pages 1548-1559
出版商
Informa UK Limited
发表日期
2018-01-25
DOI
10.1080/01694243.2018.1429860

向作者/读者发起求助以获取更多资源

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started